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ANSYS Icechip Analysis |
Samsung Electronics Inc.’s IPT group specializes in the thermal design and analysis of semiconductor packages through simulation and measurement in order to guarantee product thermal reliability. The company’s main product group encompasses microprocessors for mobile products, display drive ICs, smart cards and display panel processors. The IPT group is responsible for the analysis of leadframe, ball grid array (BGA) and tape automated bonding (TAB) packages as well as the development of new package designs through its refined package thermal analysis.
As the demand for the more complex modules of system-in-package (SIP) and package-on-package (POP) design increases, more accurate and easier-to-use simulation solutions are needed to account for the structure complexity. For this problem, ANSYS Icechip software is emerging as Samsung Electronics’ most appropriate and reliable solution.
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ANSYS Icechip - Samsung Electronics.pdf |
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