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This complimentary one-hour webinar presents how engineers can perform thermal analyses from the package level up to the system level, integrate results into the ANSYS Workbench platform to obtain additional design data and examine interactions between different physics.
This presentation is given by David Rosato, Product Manager for ANSYS, Inc.
Click here to stream the Simulation Solutions for the Electronic Industry Webinar.
The ANSYS family of products provides electronics engineers with a variety of simulation technologies including package, PCB and system level thermal management, acoustic analysis, vibration and drop test analysis, and electromagnetic simulation.
ANSYS Workbench allows engineering simulation to be conducted in a unified user environment with direct connectivity to MCAD, ECAD and leading electrical simulation tools. Integration with ANSYS Workbench enables examination of interactions between different physics and optimization of product design with conflicting design specifications, such as performance cost, weight, and mechanical and thermal reliability.
About the ANSYS Suite of Products
ANSYS solutions are widely used in the following segments of the electronics industry:
Aerospace and Automotive Electronics
Thermal management, thermo-mechanical stress, modal and vibration analysis, antenna radiation patterns, high-frequency electromagnetic analysis, PCB thermal modeling.
Computer and Storage Devices
Two-way FSI, vibration, micro channels and impingement cooling, vibration analysis; acoustic analysis, rigid and flexible body dynamics.
Consumer Electronics
Drop test; EMC, thermo-mechanical stress and Peltier coolers, natural convection and radiation modeling, EMI.
Industrial Equipment and Power Electronics
Low frequency electric and magnetic analysis, system thermal management, PCB thermal management.
Micro Electro Mechanical Systems (MEMS)
MEMS, piezoelectricity and piezoresistivity, electromagnetic fluid coupling, thermal electric structural coupling, two-way fluid structural coupling, magnetic structural coupling, acoustics structural coupling.
Networking and Communication Equipment
EMI, EMC, system thermal management, vibration analysis, fan modeling, Joule heating.
Engineering Services
Structural & Thermal Consulting