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Designers face immense pressure to create innovative electrical and electronic products faster and more cost-effectively than ever before.  CAE Associates is pleased to be partnered with ANSYS to provide the gold standard for high frequency electromagnetic simulation tools.

ANSYS electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave. You can quickly optimize your design using simulation instead of wasting time building and testing costly prototypes. So whether it's a computer chip, a circuit board, a cell phone, an electronic component in an automobile or an entire communications system, ANSYS software can help you design better products.

High Frequency Electromagnetic Simulation Software

  • ANSYS HFSS software is the industry standard for simulating 3-D, full-wave, electromagnetic fields. Its accuracy, advanced solvers and high-performance computing technologies make it an essential tool for engineers tasked with executing accurate and rapid design in high-frequency and high-speed electronic devices and platforms. Applications include communication systems, radar systems, satellites, smart phones and tablet devices. HFSS offers state-of the-art solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods to solve a wide range of microwave, RF and high-speed digital applications. Features such as automatic adaptive meshing, versatile design entry and advanced high-performance computing technology put analyst-quality solvers in the hands of the designer.
  • ANSYS SIwave is a dedicated tool for electrical analysis of full PCB and complex electronic packages, solving interrelated power integrity, signal integrity, EMI challenges to deliver predictive results for your design. It provides solutions in both the time & frequency domains with seamless integration with EDA layout tools to create customized design flows, enabling complete package system analysis using sign-off verification for package power integrity.