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Multi‐phase Boiling Analysis for Liquid Cooled Expanding Micro‐channels

Abstract:

The recent development of high power micro‐electronic chip stacking technology has provided a possible path for increasing performance for high speed computing. However, the heat load generated by the 3D chip stacks poses a significant challenge in thermal management for large arrays. Traditional cooling methods using air and internal fans are not able to provide sufficient cooling required to maintain the stack temperature within normal operation range. A highly feasible solution is to use “liquid cooling” to replace air cooled systems for several reasons: air is a poor conductor of heat compared to liquid, and liquid has a higher heat capacity than air allowing it to remove heat from the stacks more effectively.